ASML and TSMC formed a joint industry effort to move chipmaking to larger 12-inch photomasks. Photomasks are the stencils used to print circuit patterns onto silicon wafers. The two firms set up the effort on 7 September, ahead of the SPIE BACUS conference in Monterey. They aim for a pilot line using the larger masks by 2031. Full lithography systems would then enter advanced production by 2033. High NA EUV machines will first be used in production with today's 6-inch masks. ASML says the bigger masks should raise output, cut costs and remove limits on stitching patterns together. TSMC intends to use High NA in high-volume manufacturing from 2030. TSMC expects more chip layers to need High NA as transistor designs for AI work grow more complex. Other adopters and suppliers have said they are interested in joining.
What changed
High NA EUV lithography was planned around the current 6-inch photomasks.
What it unlocks
A shared industry path to 12-inch masks that removes stitching limits on large chip designs.
- 12-inch mask pilot line by 2031
- production readiness by 2033
- High NA in volume production from 2030
What you need to act on it
- mask suppliers and toolmakers joining the initiative
- timelines running to 2031 and 2033
Sources