TSMC and Samsung committed to using ASML's newest chip-printing machines. The tools, called High NA EUV, print smaller and more intricate circuit patterns. Samsung will use them for DRAM memory production from 2028. TSMC expects to adopt them around 2030 for advanced chips. TSMC cited more complex transistor designs needed for AI work. Both firms join Intel, which ASML said in July was already using the technology. The two chipmakers will also join an ASML initiative on larger 12-inch photomasks, up from 6-inch. Photomasks are the stencils used to print patterns onto silicon wafers. Barclays called the news positive and said it clarifies adoption timing. ASML shares were flat to lower in early trading.
What changed
Intel was ASML's only announced customer for High NA machines.
What it unlocks
Printing smaller, more intricate chip patterns at the two largest chipmakers.
- about $400 million per machine
- Samsung DRAM use from 2028
- TSMC adoption expected 2030
- 30% more EUV capacity in 2027
Sources